Bostik, a global adhesive specialist for industrial, construction, and consumer markets, will exhibit a range of innovative bonding and sealing solutions, including its low-pressure molding, hot melt polyurethane, silyl modified polymer (SMP), methyl methacrylate (MMA), and Born2Bond™ engineering adhesives at this year’s Assembly Show in Rosemont, Illinois, at the Donald E. Stephens Convention Center, October 25-27, 2022.
At the show, Bostik’s featured solutions will include a large portfolio of adhesives and sealant solutions for durable goods markets. This includes low-pressure molding adhesives, based on polyamide hot melt technology, which protect electronic components from moisture, dirt, and other debris. Offering vibration and chemical resistance, Bostik’s adhesives do not require mixing, streamlining operations for fragile components. Additionally, Bostik will showcase its hot melt polyurethane adhesives that maximize electronic assembly performance with high environmental resistance. The company also will feature its silyl modified polymer (SMP) products, which provide elastic properties ideal for products used in harsh conditions where flexibility is needed, as they will not peel or crack under stress. Bostik’s products are also primerless, which increases manufacturing efficiencies and reduces error likelihood. Visitors will also learn about Bostik’s methyl methacrylate (MMA) solutions, which feature multi-substrate compatibility even to composites, to increase design options and high thixotropic, non-sag formulations to improve performance.