The potting of electronic components involves filling the assembly with a compound such as liquid resin (e.g., epoxy, silicone, polyurethane) to protect it from environmental or use conditions like moisture, humidity, and vibration. Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component.

Preeflow, a ViscoTec brand, has launched the compact eco-DUOMIX, a dispensing solution that can mix and dispense silicones, epoxy resins, polyurethanes, polyester resins, and acrylates.

ViscoTec recently announced that it has developed a ceramic dispenser rotor for the reliable dosing of abrasive fluids such as thermally conductive one- and two-component gap fillers, one-component heat-conducting pastes, or highly filled two-component adhesives.