New research in adhesion science includes a reversible glue developed by a team at Newcastle University and customizable bioadhesive patches created by scientists at Pohang University of Science and Technology in Korea.
Researchers around the world are publishing their latest discoveries in scientific journals. Here are three recent developments in adhesion technology research.
The National Institute of Standards and Technology (NIST) plans to announce an open competition for a new Manufacturing USA institute focused on using artificial intelligence (AI) to improve the resilience of U.S. manufacturing.
Scientists at the Pritzker School of Molecular Engineering at the University of Chicago have developed a plastic material with the ability to take on many forms.
H.B. Fuller has received RecyClass Technology Approval in Europe for its Flextra® solution, underscoring the company’s commitment to a circular economy and enabling the transition to more sustainable packaging formats.
Silicon Catalyst will continue to provide strategic insight for DuPont into startups developing the next generation of electronic technology, materials, and devices.
Fedrigoni Self-Adhesives has developed a new range of compostable self-adhesive materials with the aim of providing high-performance labels for fully compostable packaging.
The ISCC certification system establishes a methodology to validate accounting for the CO2 capture benefits of the CCU process, as well as tracking of sustainable feedstocks using the mass balance system.
Scientists have developed a technique that allows the imaging of polymerization catalysis reactions at single-monomer resolution and, through fluorescent signaling, to differentiate monomers from one another.
The newly developed CREATS (Coupled REaction Approach Toward Super-resolution imaging) allows researchers to image polymerization catalysis reactions at single-monomer resolution and, through fluorescent signaling, to differentiate monomers from one another.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
Adhesives & Bonding Expo North America is the continent's largest, free trade fair and conference for industrial bonding products and manufacturing. Join us June 25-27, 2024, and gain easy access to co-located Foam Expo, where you can turbocharge your network, connect with industry leaders, and explore cutting-edge technology from across the entire supply chain - all under one roof with one free pass. Read More
This annual Midwest coatings conference combines all of the high-quality technical presentations, exhibits and networking opportunities from the Coatings Trends and Technologies and Powder Coating Summit conferences into one new event. The event caters to both liquid and powder coatings formulators and manufacturers. Read More
Labelexpo Americas is reportedly the largest label and package printing event in the Americas. The event offers attendees an opportunity to see live demonstrations of the latest machinery and materials, learn about global label trends and technologies, meet the world’s leading suppliers, and network with industry experts. Read More
The largest label and package printing event in South Asia, Labelexpo India brings the industry together for four days of live demonstrations. The event will feature presses, intelligent labels, finishing units, inks, dies, and substrates from top manufacturers. Read More
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