Info for Electronics

Henkel’s Adhesive Electronics Receives Awards

Mon, 12 Mar 2018 00:00:00 -0400

Henkel recently announced its adhesive electronics division has received two trophies in the annual awards contest.

Nordson’s Stockunas Joins SEMI Foundation Board of Trustees

Fri, 23 Feb 2018 00:00:00 -0500

Nordson Corp. recently announced that the SEMI Foundation has appointed Joseph Stockunas to the SEMI Foundation board of trustees.

SMTA Announces Best Papers

Wed, 17 Jan 2018 00:00:00 -0500

The Best Papers from SMTA International 2017 winners have been announced.

Adhesives and Sealants' Role in Electronics Device Design

Mon, 01 Jan 2018 07:03:00 -0500

Design is all about tradeoffs. Mobile device manufacturers have to balance everything from cost and aesthetics to performance and durability―and then design a product that can both survive and thrive in today’s competitive consumer markets.

Glass Bonding Adhesives Market to Increase 7%

Fri, 08 Dec 2017 00:00:00 -0500

The global glass bonding adhesives market is expected to reach $4.42 billion by 2025.

Top 9 Adhesives and Sealants Market Reports of 2017

Fri, 01 Dec 2017 06:00:00 -0500

The year’s most-viewed market trends stories on the ASI website from 1/1/17 to date.

IPC Pulse Survey Reveals Bullish Outlook for Electronics Market

Mon, 20 Nov 2017 00:00:00 -0500

A preliminary survey in IPC’s new Pulse of the Electronics Industry global data service reveals a bullish outlook for most segments of the electronics industry, especially for equipment manufacturers and printed circuit board (PCB) fabricators.

Keeping the Water out

Fri, 06 Oct 2017 09:00:00 -0400

International Data Corp. (IDC) discovered more than 900,00 smartphones are damaged by liquids every day globally.1 IDC’s research has found that liquid damage is the second-largest cause of damaged smartphones after broken screens, representing 35% of all devices repaired. This damage results in significant costs to the end users, device manufacturers, carriers and retailers, with the impact of liquid damage estimated to be worth nearly $100 billion each year.

TECHSIL: Momentive RTV Products

Fri, 04 Aug 2017 07:47:00 -0400

Techsil recently announced that five of Momentive’s one-part RTV silicone adhesive sealants have achieved Airbus Industrial Qualification.

Nondestructive Inspection for Heat Sink Efficiency

Thu, 01 Jun 2017 00:00:00 -0400

Electronic components that contain a die require a path by which excess heat can be removed from the component package. In low-voltage plastic-encapsulated microcircuits, the heat may simply travel by conduction through the die attach and the die paddle for dissipation through the bottom of the package.

The Next Generation

Thu, 01 Jun 2017 00:00:00 -0400

According to Grand View Research, the global market for wearable medical devices is expected to reach $27.8 billion by 2022.1 Dow Corning reportedly sees the role of specialized adhesive technologies as a key driver of this growth, especially in skin- adhered medical devices, a major segment of the wearables market.

European Coatings Show Announces Program

Fri, 17 Mar 2017 00:00:00 -0400

The European Coatings Show 2017, scheduled to take place April 4-6 in Nuremberg, Germany, will reportedly host more than 1,100 exhibitors.

ECS Returns to Nuremberg

Wed, 01 Mar 2017 07:04:00 -0500

From April 3-6, exhibitors, industry members and experts will travel to Nuremberg, Germany, to attend the European Coatings Show (ECS). The event will feature seven exhibition halls, multiple conference sessions, a keynote speaker, and two networking events.

HENKEL: Solder Paste

Mon, 27 Feb 2017 00:00:00 -0500

LOCTITE HF 2W is a tin-lead, water-washable solder paste designed for high-throughput, high-yield production.

H.B. FULLER: Active Alignment Adhesives

Fri, 17 Feb 2017 00:00:00 -0500

This company recently introduced active alignment (AA) adhesives designed for camera module assembly.

ELLSWORTH ADHESIVES EUROPE: Dymax Adhesive

Wed, 08 Feb 2017 00:00:00 -0500

This company now offers Dymax SpeedMask 9-7001.

On the Bonding Edge

Wed, 01 Feb 2017 10:01:00 -0500

A new reworkable edgebond adhesive* from Zymet has been shown to enhance the board-level reliability of a large wafer-level chip-scale package (WLCSP). The work was performed in a collaborative effort between Portland State University, Cisco, and Zymet, and published in the Proceedings of the SMTA International 2016 conference, which took place in Rosemont, Ill.

Continued Growth for Adhesives in Electronics

Wed, 01 Feb 2017 10:00:00 -0500

The global electronic adhesives market is expected to grow at a compound annual growth rate (CAGR) of close to 10% from 2017-2021, according “Global Electronic Adhesives Market 2017-2021,” a recent report from Technavio.

EPOXIES ETC.: Electrically Conductive Adhesive

Mon, 05 Dec 2016 00:00:00 -0500

This company has developed a fast-curing, electrically conductive, thin film adhesive.

Top 5 Adhesives and Sealants Market Reports of 2016

Thu, 01 Dec 2016 06:59:00 -0500

Below are the year’s most-viewed market trends stories on the ASI website (posted and viewed from 1/1/16 to date).

NORLAND PRODUCTS INC.: Optical Adhesive

Mon, 23 May 2016 00:00:00 -0400

This company has launched a high R.I. ultraviolet (UV) and visible light curable optical adhesive NOA 170 (R.I. 1.70).

ASHLAND INC.: Acrylic PSA

Fri, 13 May 2016 00:00:00 -0400

Aroset™ PS 6449 is reportedly a solution-based acrylic PSA that can deliver superior optical clarity to electronics applications.

HENKEL ADHESIVE TECHNOLOGIES: Thermally Conductive Adhesive

Tue, 12 Apr 2016 00:00:00 -0400

This company has developed a thermally conductive Technomelt material.

ELLSWORTH ADHESIVES EUROPE: Henkel Solder Paste

Mon, 04 Apr 2016 00:00:00 -0400

This company is now taking orders for GC 3W.

TECHSIL: UV Adhesive

Fri, 01 Apr 2016 00:00:00 -0400

A new adhesive is available from the Vitralit® UV 4050s series.

RADTECH: UV LED eBook

Tue, 16 Feb 2016 00:00:00 -0500

An expanded version of the UV LED eBook is now available from this company.

FEICA Issues Call for Papers

Fri, 12 Feb 2016 00:00:00 -0500

FEICA recently announced a call for papers for its 2016 European Adhesive and Sealant Conference and EXPO.