June 30, 2002
Loctite has introduced QMI 527, a silver-filled conductive adhesive for attaching integrated circuits and components to advanced substrates. Offering good rheology and easy flow under shear stresses, QMI 527 may deliver thinner bond lines when exposed to typical bond forces required for other adhesives. Optimization of die-bonding parameters is strongly recommended to consistently meet target bond-line thickness.
Circle No. 130