Utilizing Materials Suppliers to Keep Pace With Technology
For over a year, I have squirreled away a keynote address that Joe McGonnell, group vice president, Electronic and Engineering Materials, National Starch and Chemical Co., Bridgewater, N.J., presented at the Pan-Pacific Microelectronics Symposium in January 2001. This month, with the introduction of ASI's Materials Handbook, McGonnell's speech seems as relevant as it did when he presented it.
It is significant that the conference planning committee asked a materials supplier to give the keynote. It underscores the importance of the development of die-attach adhesives with exceptionally low levels of ionic impurities and low moisture take-up.