CorporateStrategies<br>Rohm and Haas Backs Up Commitment to Packaging Industry With Relocation of Midwest Tech Center and Expansion of Pilot Line
In moves signaling its commitment to the flexible packaging and converting industry, Rohm and Haas Co., Philadelphia, has recently relocated its technical center and announced the construction of a new pilot coating and laminating facility.
During the first half of 2002, the Adhesives and Sealants Packaging and Converting business relocated its Midwest Technical Center to a new facility in Elgin, Ill. (See sidebar.) Now, Rohm and Haas is completing this relocation by moving its pilot coating and lamination line to a new facility located at its Ringwood, Ill., manufacturing site.