New Self-Filleting™ AAA1002A die-attach adhesive exhibits capillary flow during a programmed temperature ramp-up and achieves 100% area coverage under die without producing a bulky fillet that can overflow onto the top of thin die before cure-onset temperature is reached. Compared to die-attach film, AAA1002A is significantly less expensive, and it wets and fills the undulating BGA substrate better, therefore achieving a higher reliability level. The Self-Filleting process extends the service life for existing die-bonders and allows users to continue to benefit from the cost and reliability of a die-attach paste. Also, die-attach adhesive costs are independent of wafer yield, and capital investment in tape-bonding equipment is not required.