This company has released several new products, including: a structural epoxy adhesive with high hot-wet glass-transition temperatures (Tg); a halogen-free epoxy adhesive that meets the requirements of FAR 25.853; and a low-density, very high compressive strength edge filler. The products were reportedly formulated to meet the needs of aircraft manufacturers for easy-to-handle materials, providing fast, durable bonding of aircraft composite substrates and reinforcement for honeycomb panels.
Epibond® 100 A/B high-temperature, epoxy structural adhesive is designed for bonding primary composites components and metal parts. It can provide high hot/wet Tg with 94% property retention after exposure of 62 days at 145°F and 85% RH, and excellent high-temperature lap shear strength with 75% property retention.