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DEK EXPANDS NEXT-GEN STENCIL TECHNOLOGY DEVELOPMENT

March 8, 2004
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DEK has announced that its Eform stencil manufacturing process has taken electroform stencils to the next level by incorporating an exclusive, sophisticated aperture height control method to their production of Eform stencils. DEK's Eform stencils incorporate the latest technologies and offer many benefits. Eform stencils provide superior performance and ensure seal contact to the pad(s), pad paste deposit and a greater percentage volume of paste on pad. The reactive force created by DEK Eform stencils provides for an even distribution of paste and allows for a more clean release of paste from the aperture. This technology also delivers ultimate control over stencil thickness and uniformity, ensuring outstanding paste volume consistency for fine pitch applications. But, when DEK's Eform stencil process is combined with its innovative new technology, termed Veriable Aperture Height Technology (VAHT), it becomes even more powerful. As Richard Tang, DEK global Eform manager, explains, "Board co-planarity issues are a prevalent problem. The uneven resist layer causes a poor seal between the board and the stencil, which can result in printing problems. DEK has that problem solved. Our Variable Aperture Height Technology, an inherent characteristic of DEK's Eform stencils, adjusts for the variances in resist layer heights and provides a uniform seal across the entire board."

For more information, visit http://www.dek.com .

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