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DOW CORNING: Thermal Encapsulant

November 15, 2004
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Dow Corning Corp. has introduces a new thermally conductive encapsulant, DOW CORNING SE 4451, with a pre-qualified, turnkey dispensing process. The combined material-and-process offering is one of the first developments to emerge from the External Equipment Provider Alliance launched by Dow Corning earlier this year. Designed for the stringent heat-management needs of electronic power devices, SE 4451offers a unique combination of high thermal conductivity (3W/mK at 25 degrees C) and low viscosity (32,000 cPs). The material's properties enable fast dispense and cure times, thereby reducing costs in volume manufacturing. Dow Corning worked with alliance member Liquid Control Corp., a leading provider of dispensing equipment, to develop a turnkey dispensing process for the new encapsulant.

For more information, visit http://www.dowcorning.com/electronics .

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