The electronics group of Henkel has announced that halide-free, no-clean Multicore® MP218™ solder paste has now been optimized to enable modern Sn-Pb processes, thus allowing for the inevitable interaction with lead-free solder pastes. However, extra activity and wider reflow capabilities are specifically intended to overcome the wetting issues caused by the combination of Sn-Pb solder and Pb-free device finishes. Interaction between Sn-Pb solder and Pb-free finishes exacerbates the traditional problems of temperature and humidity variations commonly associated with the rise of lead-free. A high humidity resistance means that Multicore MP218 is able to avoid the humidity-related problems of premature drying and excessive moisture absorption, enabling a consistent global performance. The behavior of the Multicore solder paste is further enhanced by a new anti-tombstoning formulation, designed to extend the liquidus time of the solder during reflow, increasing the wetting window for each end of the component. This reduces the possibility of costly tombstoning defects and enables effective joint formation.
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