New Products

New Products (Week of 12/5/05)

November 30, 2005
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Week of 12/5/05

ADVANCED APPLIED ADHESIVES: Die Attach Adhesive

New Self-Filleting™ AAA1002A die-attach adhesive exhibits capillary flow during a programmed temperature ramp-up and achieves 100% area coverage under die without producing a bulky fillet that can overflow onto the top of thin die before cure-onset temperature is reached. Compared to die-attach film, AAA1002A is significantly less expensive, and it wets and fills the undulating BGA substrate better, therefore achieving a higher reliability level. The Self-Filleting process extends the service life for existing die-bonders and allows users to continue to benefit from the cost and reliability of a die-attach paste. Also, die-attach adhesive costs are independent of wafer yield, and capital investment in tape-bonding equipment is not required.

For more information, call (858) 348-1125 or e-mail info@appliedadhesives.com .

AREMCO PRODUCTS INC.: Electrically Conductive Adhesive

Aremco-Bond™ 556 is a new silver-filled, high-temperature, electrically and thermally conductive adhesive used to produce electronic and high-vacuum components for applications to 340°F. This product mixes easily in a 1:1 ratio by weight or volume. It sets at room temperature in 24 hours or can be heat cured in 4 hours at 170°F or 2 hours at 210°F. 556 comes in standard 50-gram kits, but can be specially packaged in divided bi-packs or pre-mixed and frozen syringes. Typical applications include sensors used in high-vacuum system, high-temperature connectors and specialty lighting, electronic, and semiconductor components.

For more information, visit www.aremco.com, call (845) 268 0039 or e-mail aremco@aremco.com .

AVERY DENNISON: Label Applicator

The AVERY DENNISON™ ALS 104 applies preprinted product ID labels, including bar-coded labels, to boxes, cartons and other items at speeds up to 25 meters per minute. The ALS 104 features a rugged, all-steel housing designed to safeguard key components and electronics in factory environments. It is controlled from a built-in display panel that rotates 280° or can interface with PLCs on the factory floor. The system's compact 19.6" x 14.8" footprint makes it ideal for use on limited-space conveyor and packaging lines. The ALS 104 applies tabs and labels in widths up to 4.4 in (110 mm) and can accommodate label rolls up to 12 inches (300 mm). The system is available in right- and left-hand configurations.

For more information, visit http://www.ris.averydennison.com .

GE: Prepolymer

SPUR+ Y-15735 LM prepolymer is the low-modulus member of this company's new family of next-generation silylated polyurethane resins for adhesives, sealants and coatings applications. SPUR+ prepolymers offer exceptional adhesion to a wide range of porous and non-porous substrates: metals, glass, ceramics and plastics - even wet, primerless concrete. Specifically, SPUR+ Y-15735 LM prepolymer is three times as fast in tack-free time and enhances deep-section cure under ambient conditions by about 50%, compared to similar resins with earlier silane end-capping technologies. Enhanced deep-section cure can benefit applications that use a thick layer of adhesive or sealant.

For more information, visit http://www.geadvancedmaterials.com .

RAPRA TECHNOLOGY: Polyol Handbook

The main raw materials used for the production of polyurethanes are polyols, isocyanates and propylene oxide. The first of these is the subject of the latest Rapra handbook, Chemistry and Technology of Polyols for Polyurethanes. This book considers the raw materials used to build the polyurethane polymeric architecture. It covers the chemistry and technology of oligo-polyol fabrication, the characteristics of the various oligo-polyol families and the effects of the oligo-polyol structure on the properties of the resulting polyurethane. It presents the details of oligo-polyol synthesis, and explains the chemical and physico-chemical subtleties of oligo-polyol fabrication.

For more information, visit http://www.polymer-books.com or e-mail publications@rapra.net .

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