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ZYMET: Underfill Encapsulant

November 15, 2004
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Zymet has introduced a new reworkable underfill encapsulant, CN-1531, designed for CSP and BGA encapsulation. It is a higher Tg version of the previously introduced CN-1432, with a Tg of 110 degrees C instead of 70 degrees C, for more severe thermal cycle requirements. CSPs and BGAs are not normally encapsulated. However, it has been found that mobile phones and other handheld devices require encapsulation of these components to survive drop tests and repeated keypad actuations. With this reworkable underfill encapsulant, removal of defective CSPs and BGAs is easily accomplished by heating the component and the underfill encapsulant to 220 degrees C. Underfill encapsulants are easily scraped or brushed off. CN-1531 has a viscosity of 5,000 cps at room temperature, making it very easy to dispense. It is also fast flowing, capable of flowing a distance of 18 mm with only a single-side dispense in as little as 15 seconds.

For more information, e-mail info@zymet.com .

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