The conference brings together all the parties with an interest in wood adhesives: adhesive researchers, suppliers and users, and users of the bonded product who represent industry, academia, government, and other organizations. This conference provides an excellent opportunity to interact with leaders in the field from around the world (over 200 from 28 countries attended the 2009 meeting) and hear about the latest developments.

Session topics will include:
• Energy concerns and opportunities for bonded forest products
• Structure and properties of bonded wood products
• Impact of regulations and consumer preference on wood products
• New wood-based bonded products
• Bio-based and novel adhesive systems, resin chemistry
• Bonding to unconventional substrates
• Analytical and Testing Methodology
• Developments in Fundamental Understanding of Wood Bonding
• Modeling
• Composites
• Engineered wood products
• Other applications