New Program Format
The 2008 FEICA Conference will offer a Technical Day and a
Business Forum. The Technical Day, Sept. 11, will have the following parallel
sessions.
- Technical Track. New
innovative materials and green technologies
- Legislation Track. Legislation issues
including REACH implementation, GHS, indoor air, etc.
- Service Provider Track. New innovative
services within strategic management, HR, IT and others.
The sessions will be followed by a Gala Dinner.
On Sept. 12, the half-day Business Forum “Meeting Challenges Through
Innovation” will include several industry leaders sharing their vision about
our industry’s challenges and discussing how innovation will contribute to
meeting them. Panelists include Vittorio Maglia, director of the Economic
Analysis and Internationalisation Department of FEDERCHIMICA, Federchimica; Dr.
Ramón Bacardit, corporate senior vice president of Adhesives Technologies
Research, Henkel KGaA; Michael St. Pierre, director of Business Development
EAME, Huntsman Polyurethanes; Bruno Charrièr, Global Innovation director,
Bostik; Dr. Raija Polvinen, R&D manager, Kiilto Oy; and Gonzague Six,
Global Marketing leader, Dow Chemical.
FEICA Expo 2008
The exhibition, an essential part of the conference, is an
effective way to reach key people within the adhesives and sealants industry.
This year, the Expo will be integrated in the conference more intensively
— lunch and all coffee breaks will take place in the exhibition hall, doubling
the total exhibition time to six hours.
Exhibitors as of June 12 include:
- Adhäsion Kleben & Dichten/GWV Fachverlage GmbH
- Adhesives & Sealants Industry
magazine
- Bayer MaterialScience AG
- EAS European Adhesives & Sealants magazine -
DMG World Media
- Evonik Degussa GmbH
- Shiraishi-Omya GmbH
- SpecialChem
- Sulzer Mixpac Ltd.
- TAH, a Nordson Co.
- Technical University Braunschweig, Institute of Joining and
Welding
For more information, visit www.feica.com.
