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Chapman to Give Keynote Address at Adhesives for Product Assembly Symposium

May 22, 2001
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TROY, Mich. — Gilbert B. Chapman II, senior manager, Advanced Materials, Liberty and Technical Affairs, DaimlerChrysler Corp., Rochester Hills, Mich., will present the keynote address at the Adhesives for Product Assembly Symposium, June 18-19, 2001, in Troy, Mich. The symposium is co-sponsored by the Adhesive and Sealant Council and Adhesives & Sealants Industry magazine.

Chapman’s address will focus on the need and requirements for adhesive bonding of thermoplastic composites in automotive body assemblies. The drive to improve the overall energy efficiency of automobiles without compromising capacity, performance, appearance or price has motivated innovative approaches to vehicle weight reduction without a concomitant cost increase. One such an approach is an injectionmolded thermoplastic composite body mounted on a metal frame. Adhesive bonding is being evaluated as a leading joining candidate. The presentation will outline the joining requirements and constraints, relate the industry requirements, and present preferred methods of evaluating bond joints against those requirements.

For more information on the symposium, as well as a list of speakers and speeches, see pages 100 and 101 of this issue. Or visit the ASI Web site, www.adhesivesmag.com.

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