Adhesives Mag logo
search
cart
facebook twitter linkedin youtube
  • Sign In
  • Create Account
  • Sign Out
  • My Account
Adhesives Mag logo
  • NEW PRODUCTS
  • NEWS
    • Adhesives & Sealants Headlines
    • Mergers/Acquisitions
    • Market Trends
    • TOP 20
  • TOPICS
    • Finished Adhesives and Sealants
    • Pressure-Sensitive Adhesives (PSAs)
    • Coatings
    • Raw Materials and Chemicals
    • Materials Handling/Processing
    • Meter/Mix/Dispense
    • Curing
    • Testing/Quality Control
    • Packaging of Adhesives & Sealants
    • Converting/Packaging
    • Composites
    • Sustainability
  • EVENTS
    • ASI Academy
    • Events Calendar
  • COLUMNS
    • European Perspectives
    • Strategic Solutions
    • Supply Chain Strategies
    • Tape Talk
  • MULTIMEDIA
    • Videos
    • Podcasts
    • Webinars
    • eBooks
  • EXPLORE
    • Adhesives in Action
    • Blog
    • ASI Store
    • Industry Links
    • Market Research
    • Classifieds
  • DIRECTORIES
    • Buyers' Guide
    • Global Adhesives & Sealants Directory
    • Raw Materials, Chemicals, Polymers and Additives Handbook
    • Equipment Handbook
    • Distributor Directory
  • EMAGAZINE
    • EMAGAZINE
    • ARCHIVE ISSUES
    • ADVERTISE
      • Custom Content & Marketing Services
    • CONTACT
  • SIGN UP!
Home » Events » National Conference on Electronics Design, Assembly and Reliability (NCEDAR)

Refine your results by

National Conference on Electronics Design, Assembly and Reliability (NCEDAR)

KEYWORDS: assembly
12/4/12 to 12/6/12
Indian Institute of Science
Bangalore
India

 IPC — Association Connecting Electronics Industries® will host a new event in India focused on expanding electronics manufacturing expertise. The inaugural National Conference on Electronics Design, Assembly and Reliability (NCEDAR), will be held at the Indian Institute of Science in Bangalore, India, December 4–6, 2012.

The new conference and exhibition was created in response to a growing need for a local event focused specifically on the needs of the Indian electronics manufacturing industry.

“NCEDAR represents IPC’s commitment to bringing additional services and educational opportunities to India,” says David Bergman, IPC vice president of international relations. “It provides a new venue for industry professionals to expand their skills, share their expertise and find solutions.”

The three-day event will open with a day of workshops targeting critical trends and technology, followed by a two-day conference covering a broad range of technical topics, including design simulation and modeling; electronic components, RF and optoelectronics; advanced packaging; PCB assembly and manufacturing technology; materials and processing; and reliability and quality control.

In addition, exhibitors will be on-hand at NCEDAR to present equipment, systems and supplies to help attendees solve electronics manufacturing challenges. Special events during the conference will include thought-provoking keynote sessions, as well as a PCB design contest and hand soldering competition.

“From the beginning, we wanted to ensure that local members and experts had a strong voice in the development of NCEDAR,” says Akshinthala Vijayendra, managing director of IPC India. Working together, IPC India, the Indian Institute of Science in Bangalore and a technical advisory committee determined the content and direction of the event. The technical advisory committee, chaired by Professor G.V. Mahesh of the Indian Institute of Science, consists of IPC members from universities, OEMs, EMS companies and government agencies in India.

While more than 30 technical papers have been accepted, conference organizers will consider additional submissions through November 1. For more information about requirements for technical paper submission, visit www.ipcindia.org.in/ncedar-cfp. Exhibitor opportunities are still available as well. Details can be found at www.ipcindia.org.in/ncedar-exhibiting.

Registration for NCEDAR is now open online, with special “early bird” rates available to those registering before November 1, 2012. For detailed information about the conference and to register, visit www.ipcindia.org.in/ncedar-registration or send an e-mail to ncedar@ipc.org.
 

Register for this Event

Related Articles

3M and Nordson Collaborate on Electronics Assembly Products

Adhesives and Sealants' Role in Electronics Device Design

12th Internatio​nal Conference on Biocomposi​tes Seeks Papers

Ask Dr. Dave: December 2012

Manage My Account
  • eMagazine Issues
  • Newsletters
  • Online Registration
  • Manage My Preferences
  • Subscription Customer Service

More Videos

Sponsored Content

Sponsored Content is a special paid section where industry companies provide high quality, objective, non-commercial content around topics of interest to the Adhesives and Sealants Industry audience. All Sponsored Content is supplied by the advertising company and any opinions expressed in this article are those of the author and not necessarily reflect the views of Adhesives and Sealants Industry or its parent company, BNP Media. Interested in participating in our Sponsored Content section? Contact your local rep!

close
  • Assembly automation for medical device manufacturing
    Sponsored byNordson EFD

    Three Proven Principles Powering Quality Assembly

Popular Stories

Photo of shoe on shovel breaking into dirt

H.B. Fuller to Open Aerospace Manufacturing Center of Excellence

Image of a blue bar chart with arrow pointing up

Iran War and Logistics Challenges Impact Adhesives and Sealants Pricing

news on internet screen

H.B. Fuller and Ancora Holdings Clash Over Proposed Medical Adhesives Acquisition

ASI Top 20 website

Products

Structural Adhesives: Properties, Characterization and Applications

Structural Adhesives: Properties, Characterization and Applications

See More Products

ASI CASE EBOOK

ASI raw materials roundup

Keep the info flowing with our newsletters!

Get the latest industry updates tailored your way.

JOIN TODAY!
  • RESOURCES
    • Advertise
    • Contact Us
    • Directories
    • Manufacturing Division
    • Store
    • Want More
  • SIGN UP TODAY
    • Create Account
    • eMagazine
    • Newsletters
    • Customer Service
    • Manage Preferences
  • SERVICES
    • Marketing Services
    • Reprints
    • Market Research
    • List Rental
    • Survey & Sample
  • STAY CONNECTED
    • LinkedIn
    • Facebook
    • Youtube
    • X (Twitter)
  • PRIVACY
    • PRIVACY POLICY
    • TERMS & CONDITIONS
    • DO NOT SELL MY PERSONAL INFORMATION
    • PRIVACY REQUEST
    • ACCESSIBILITY

Copyright ©2026. All Rights Reserved BNP Media, Inc. and BNP Media II, LLC.

Design, CMS, Hosting & Web Development :: ePublishing