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Dow Packaging and Converting Technical Center to Move to Buffalo Grove, IL

March 29, 2010
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The Dow Chemical Co.'s North American Technical Service and Global Research and Development Center for packaging adhesives and coatings will move from Elgin, IL, to Buffalo Grove, IL, in early April. The expanded Tech Service and R&D Center represents a significant step forward in the company’s commitment to enhance customer support and new product development. Buffalo Grove is located in close proximity to Chicago’s O’Hare Airport.

“Substantially strengthening our resources and capabilities for our packaging customers - both in North America and around the world - was the motivation for this relocation,” said Sarah Eckersley, global research and development director for Adhesives and Functional Polymers.

Dow offers a range of technologies for packaging customers, including solventless, water-based and solvent-borne adhesives. The company also provides real-world testing capabilities to assist customers in the evaluation of formulations on production-scale equipment.

The Buffalo Grove facility, which opened in 1992, also houses Dow’s Microbial Control business unit, as well as sales offices.

For more information, visit www.dow.com.

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