Forbo Adhesives, LLC and Industrial Adhesives, Inc. recently announced the formation of a strategic alliance that grants Forbo the right to exclusively distribute Industrial's Hot Melt Wide Tape products under the Packtape and Packstring trade names worldwide.
IPC - Association Connecting Electronics Industries and JEDEC, the Solid State Technology Association, have announced plans to further their efforts in preparing electronics manufacturers for the inevitable European ban on lead by co-sponsoring three International Conferences on Lead Free Electronic Components and Assemblies in the U.S., Europe and Asia in 2004.
Loveland, OH-based Henline Adhesive Equipment Company Inc. (HAECO) has announced its acquisition of Can-Tron Industrial Controllers, a California-based designer and manufacturer of embedded electronic controls.
After the perennial top concern over cost reduction, safety is rated as the number one challenge among automotive engineers to stay competitive in the design of the next generation of motor vehicles, according to the 10th annual DuPont sponsored survey of those planning to attend the 2004 SAE World Congress and Exposition, March 8-11.
DEK has announced that its Eform stencil manufacturing process has taken electroform stencils to the next level by incorporating an exclusive, sophisticated aperture height control method to their production of Eform stencils.
Fusion UV Systems, Inc. has announced plans to conduct live UV inkjet printing demonstrations during the upcoming e|5 2004 RadTech North America Technology Expo & Conference being held May 2-5 at the Charlotte Convention Center in Charlotte, NC.