It was a simple email message, but it gave me pause. I had responded to an inquiry within minutes of its arrival in my email inbox, and received a compliment back, praising my prompt response. I was surprised not only that my response time was noticed, but that it was acknowledged with such positivity.
The Japan Adhesive Industry Association will host the World Adhesive & Sealant Conference 2016.
October 3, 2016
The World Adhesive & Sealant Conference 2016 (WAC2016) is scheduled to take place October 26-28 at the Shinagawa Prince Hotel in Tokyo. The main theme of WAC2016 is Creating Tomorrow, with three keywords: Environment, Creation, and Evolution. Some 700 delegates are expected to attend from around the world, representing adhesive and sealant manufacturers and suppliers to the industry.
Discover new technologies and innovations in Indianapolis at this year’s ASC Fall Convention and Expo.
October 3, 2016
From October 17-19, experts from across the adhesives and sealants industry will come together at the Adhesive and Sealant Council (ASC) Fall Convention and Expo in Indianapolis. The event offers speakers, short courses, a lively exhibition floor, and multiple chances to network with industry experts, clients, end users, and researchers.
Fall is in the air, which can only mean one thing: travel season! In this issue, we’re previewing two key events coming up in our industry—the Adhesive and Sealant Council’s Fall Convention and Expo, and the World Adhesives Conference.
Automotive and commercial transportation manufacturers must design and produce vehicles that meet both consumer expectations and government standards for safety, comfort, performance, and sustainability.
I invite you to join us in Indianapolis October 17-19 for the ASC’s Fall Convention and Expo. This will be the first convention and expo under the leadership of our new president, William Allmond. We hope you can join us to welcome Bill, network with colleagues in the industry, and attend the exciting technical and marketing program we have scheduled.