Finished Adhesives and Sealants / New Products

HENKEL: Electronics Encapsulant

April 9, 2012
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This company’s low-pressure molding MACROMELT technology portfolio has been expanded to include a material designed specifically for high thermal stability and chemical resistance. MACROMELT MM6208 reportedly offers all of the inherent benefits consistent with MACROMELT technology, but has a high (95°C) relative temperature index (RTI) rating, allowing its use for certain automotive, consumer and appliance applications where a very high RTI rating is required for good thermal stability. At 95°C, the material reportedly carries the highest RTI rating in its class of materials, as the majority of hot-melt systems have RTIs of 65°C or less.

Like all MACROMELT materials, MACROMELT MM6208 has reportedly been designed with superior performance, device protection and ease-of-use at its core. These materials are polyamide-based hot-melt formulas that can quickly over-mold, encapsulate and protect exposed circuitry while simultaneously forming the product’s outer shell. Once encapsulated, the product becomes a self-contained integrated assembly. The MACROMELT process uses an exceptionally low application pressure of between 20 and 500 psi, which can reduce stress and damage for sensitive electronic components. In addition, its very low modulus and hardness allow it to be used for flexible applications

For more information, visit www.henkel.com/electronics.

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