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Adhesive & Sealant ProductsFinished Adhesives and Sealants

HENKEL: Electronics Materials

Electronics_Generic
January 31, 2019

Henkel Corp. recently announced it will debut several new materials at IPC APEX Expo, which takes place January 29-31 in San Diego, Calif. The company will reportedly display products including:

  • New LOCTITE® solder materials and fluxes for high-reliability automotive applications.
  • Low-pressure molding TECHNOMELT® to facilitate automated masking of keep out zones prior to conformal coating processes.
  • BERGQUIST® thermal control solutions in liquid and pad formats, which can ensure effective heat dissipation for increased reliability. 

For more information, visit www.henkel.com.

KEYWORDS: adhesives in electrical/electronic

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