HENKEL: Electronics Materials
Henkel Corp. recently announced it will debut several new materials at IPC APEX Expo, which takes place January 29-31 in San Diego, Calif. The company will reportedly display products including:
- New LOCTITE® solder materials and fluxes for high-reliability automotive applications.
- Low-pressure molding TECHNOMELT® to facilitate automated masking of keep out zones prior to conformal coating processes.
- BERGQUIST® thermal control solutions in liquid and pad formats, which can ensure effective heat dissipation for increased reliability.
For more information, visit www.henkel.com.