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Items Tagged with 'adhesives in electrical/electronic'
These adhesives offer a number of advantages over mechanical solutions, such as long-term reliability, increased versatility of application, and protection against corrosion.
October 7, 2021
Bostik, an Arkema company, has launched a new range of high-performance anaerobic adhesives to provide engineers with alternatives to commonly used mechanical fastening solutions such as washers, gaskets, pins, hemps, and tapes.
The adhesive allows precise positioning of optical lenses within a transceiver optical sub-assembly.
October 5, 2021
Henkel has developed LOCTITE® STYCAST® OS 5101, a dual-cure adhesive for optimal, precise optical lens and component alignment during the in-line assembly process for optical transceivers in next-generation cloud and hyperscale data centers.
Sika serves as the adhesive bonding technology partner for a world record attempt featuring a 100% solar-powered vehicle.
September 28, 2021
Sika is sponsoring the Peak Evolution expedition, a challenging project to reach a new world record. The Peak Evolution team is developing an innovative and sustainable agricultural vehicle called TERREN, working completely with electrical power.
Henkel will introduce a new structural bonding method that accurately and efficiently cures adhesives in display applications.
September 15, 2021
At the Vehicle Displays & Interfaces Symposium, which will be held September 28-29 online and in Detroit, Mich., Henkel will introduce a new bonding solution that reportedly brings speed, performance, and flexibility to display manufacture.
The Adhesive and Sealant Council (ASC) announces its Training Academy schedule for 2014 which will include 14 new program titles that includes a blend of 101/201 training, business trends webinars and value-added regulatory topics. Read More
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.