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Greater emphasis and understanding and, above all, a change of habit and experience in moving away from physical actuation toward using voice in the home will support greater smart home expansion throughout individual homes.
April 7, 2020
A global emphasis on working from home, combined with advice to minimize COVID-19 transmission from shared surfaces even within a home, will help cement the benefits of smart home voice control for millions of consumers.
According to Toyochem, TSS510-HF addresses the needs of today’s electronics designers for improved shielding performance for the transmission of high-frequency signals and for high flexibility so circuits do not break when bent.
April 2, 2020
Toyochem Co., Ltd., a member of the Toyo Ink Group, has launched a flexible electromagnetic interference (EMI) shielding film, LIOELM TSS510-HF, designed to meet the performance requirements of 5G flexible printed circuits (FPCs).
This thermally conductive compound reportedly offers high dielectric properties with a volume resistivity of 1,015 ohm-cm.
March 19, 2020
EpoxySet recently announced that it supplies EC-1012M/EH-20 flame-resistant potting compound for protecting power supplies, high-voltage batteries, coil windings, transformers, PC boards, and other electronic devices.
Electric vehicles (EVs) have been rapidly adopted in recent years, and the rate of market growth has shown to be significantly higher than that of the fuel-injected automotive market. Indeed, the global stock of electric cars surpassed five million in 2018.
Every four years, the adhesives and sealants community gathers at the World Adhesive and Sealant Conference (WAC) to explore opportunities for education, networking, and growth. This year’s event, hosted by the Adhesive and Sealant Council (ASC) and co-organized by the Asia Regional Adhesive Council (ARAC) and FEICA (association of the European Adhesive and Sealant Industry), will be held April 20-22 at the Chicago Hilton in Chicago, Ill.
The Adhesive and Sealant Council (ASC) announces its Training Academy schedule for 2014 which will include 14 new program titles that includes a blend of 101/201 training, business trends webinars and value-added regulatory topics. Read More
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
The World Adhesive & Sealant Conference (WAC) is the most important international event for stakeholders in the Adhesive and Sealant industry worldwide. WAC takes place only once every four years alternating between the United States, Europe and Asia. Read More