DELO PHOTOBOND SJ4195 is a UV-curing structural adhesive characterized by its excellent adhesion to magnesium die cast (12 MPa) and features low outgassing, making it suitable for structurally bonding optical components.
Adhesives are no longer background consumables; they are strategic enablers of greener supply chains, lighter designs, and smarter high‑speed manufacturing.
Innovations in eco-friendly technologies, lightweight materials for automotive applications, and skin-friendly medical adhesives are key trends shaping the PSA market.
The Resbond™ 940 Customizable series offers economical, fast-setting ceramic adhesives designed to solve all high-temperature bonding, sealing, or encapsulating applications.
The Adhesive and Sealant Council (ASC) announces its Training Academy schedule for 2014 which will include 14 new program titles that includes a blend of 101/201 training, business trends webinars and value-added regulatory topics. Read More
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.