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Items Tagged with 'adhesives in electrical/electronic'
According to Dow, this new adhesive cures at room temperature and provides fast adhesion for shorter cycle times.
June 30, 2020
Dow recently introduced its new DOWSIL™ EA-3838 Fast Adhesive, a primerless silicone adhesive that cures rapidly without oven heat for improved productivity and reduced energy usage in the manufacture of appliances, automotive electronics, lighting, and avionics.
With electronic systems expected to reach 50% of the total car cost by 2030, electronics companies are of critical importance in the automotive supply chain.
June 26, 2020
To reinforce the importance of quality in process and manufacturing, standardization for supply chain effectiveness, and industry advancement, IPC and the Automotive Industry Action Group (AIAG) recently renewed their cooperative agreement.
As the marketplace for consumer electronics devices becomes more sophisticated, the adhesive products that hold them together have to be just as versatile and multifunctional. Consumers have demanded their devices get sleeker, more powerful, and lighter, putting demands on manufacturers.
The Pressure Sensitive Tape Council defines a pressure-sensitive adhesive (PSA) as requiring two things: aggressive and permanent tack, and adhesion with finger pressure. This simple definition makes the concept of a PSA easy for anyone to understand.
Vacuum potting is mainly aimed at electronic components with small openings and complex internal structures.
June 10, 2020
The potting of electronic components involves filling the assembly with a compound such as liquid resin (e.g., epoxy, silicone, polyurethane) to protect it from environmental or use conditions like moisture, humidity, and vibration. Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component.
The Adhesive and Sealant Council (ASC) announces its Training Academy schedule for 2014 which will include 14 new program titles that includes a blend of 101/201 training, business trends webinars and value-added regulatory topics. Read More
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
The World Adhesive & Sealant Conference (WAC) is the most important international event for stakeholders in the Adhesive and Sealant industry worldwide. WAC takes place only once every four years alternating between the United States, Europe and Asia. Read More