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Home » Keywords: » adhesives in electrical/electronic
Items Tagged with 'adhesives in electrical/electronic'
Novel formulation for grounding applications provides room-temperature moisture cure capability to protect heat-sensitive substrates while improving yield and enhancing reliability
Designed to deliver robust electrical grounding performance, this moisture-cure ECA helps to safeguard the thin, miniaturized substrates within mobile device camera components.
Henkel has developed a new adhesive – Loctite 3296 – a dual-cure adhesive for lens bonding in ADAS sensors. The new product provides a very high-cure depth after only a few seconds of exposure to UV-light and is designed to bond particularly well to aluminum and FR4.
Henkel has launched a new dual-cure adhesive specifically designed for bonding applications in automotive ADAS cameras and LiDAR modules. Using a unique UV cationic thermal dual-cure epoxy, Loctite Ablestik NCA 3218 offers a solution for applications such as lens barrel-to-housing and lens housing-to-circuit board bonding.
The live event – to be held February 22-23, 2023 – is aimed at users and specialists from the electrical and electronic engineering sector, both from production and development. Registration is open until February 10, 2023.
Henkel recently announced the acquisition of the Thermal Management Materials business of Nanoramic Laboratories, headquartered in Boston, Massachusetts.
Pressure-sensitive adhesive tapes offer functionality, versatility, and customization as the automotive industry produces more EVs and increases the integration of electronic systems into vehicles.
The trends of integration of electronic systems into vehicles and the shift to electric vehicles are creating new opportunities for pressure-sensitive adhesive tapes.
The Adhesive and Sealant Council (ASC) announces its Training Academy schedule for 2014 which will include 14 new program titles that includes a blend of 101/201 training, business trends webinars and value-added regulatory topics. Read More
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.