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Items Tagged with 'adhesives in electrical/electronic'
The U.S. Partnership for Assured Electronics was established in 2020 with a mission to ensure the U.S. government has access to resilient and trusted electronics supply chains.
The U.S. Partnership for Assured Electronics (USPAE) is inviting electronics manufacturers and related companies to participate in its programs, highlighting the opportunities to collaborate with industry peers and the U.S. government.
Henkel and North Carolina State University's Future Renewable Electric Energy Delivery and Management (FREEDM) Systems Engineering Research Center recently announced a new partnership agreement designed to study the impact of materials technology on power electronics applications.
IPC APEX EXPO 2021’s virtual platform will allow attendees, exhibitors, and speakers to easily navigate more than 100 technical conference sessions, professional development courses, and product demonstrations.
IPC APEX EXPO 2021 is being held virtually on March 8-12, 2021. “Given ongoing COVID-19 health and safety concerns and continued restrictions for large gatherings and events in California, it was not feasible to safely convene the nearly 9,000 expected participants at IPC APEX EXPO 2021,” said John Mitchell, IPC president and CEO. “The event will now take place in a safe, all-virtual format.”
Growth of the glass bonding adhesives market is sustained by rising application in a range of industries, including construction, automotive, and healthcare.
Panacol has expanded its portfolio of dual-curing acrylic adhesives with the introduction of Vitralit® UD 8052 F, a low-viscosity, one-component UV-curable adhesive.
Henkel Adhesive Technologies and Belgium-based Quad Industries have announced the expansion of their strategic partnership to offer capacities and support for technological value creation and prototyping with printed electronics solutions across multiple industries.
Properties include ultra-low shrinkage, superior and variable light transmission properties, resistance to discoloration, and resistance to both thermal and mechanical damage.
HumiSeal® has introduced a complete line of liquid, optically clear adhesives that provide enhanced optical properties and improved durability of optical devices and displays.
IPC recently announced the December 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program, reporting that orders were up by 4.5% compared to the same month last year.
The Adhesive and Sealant Council (ASC) announces its Training Academy schedule for 2014 which will include 14 new program titles that includes a blend of 101/201 training, business trends webinars and value-added regulatory topics. Read More
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
The World Adhesive and Sealant Conference & EXPO (WAC) is the most important international event for stakeholders in the adhesive and sealant industry worldwide. Read More