Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.

With a theme of “Diversification Research and Development of Advanced Materials,” the International Congress on Advanced Materials Sciences and Engineering (AMSE-2020) will include a plenary forum, 31 breakout sessions, and poster sessions covering topics ranging from semiconductor and electronic materials to nanomaterials and polymer materials.

SEMICON Southeast Asia 2020 is the region’s premier event for the global electronics manufacturing supply chain.

The Afera Technical Seminar brings together tape industry professionals for updates on the cutting-edge technical issues driving the adhesive tape industry.

For the past 13 years, Converters Expo has showcased converting solutions from packaging and bags to tissues and diapers, and more.

Labelexpo Southeast Asia will offer a collection of the latest technologies and state-of-the-art materials in labels and package printing.

EURADH is organized by the French adhesion division (SFA) of the French Vacuum Society (SFV), with the support of the Dechema (Germany), the Society of Adhesion and Adhesives (UK), the Portuguese Adhesion Society, De Bond voor Materialenkennis (Netherlands), Grupo Espanol de Adhesion y Adhesivos (Spain), and the Italian community of adhesion.

Launched in 1989, Labelexpo Americas is the largest label event in the Americas.

CAMX—the Composites and Advanced Materials Expo—is a comprehensive composites and advanced materials event for products, solutions, networking, and advanced industry thinking.

The 5th Future of Surfactants Summit North America 2020 will bring together senior executives and experts from the surfactants industry.