Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.

Smart materials are one of the most important researching directions in the development of high-tech new materials.

The Afera Technical Seminar brings together tape industry professionals for updates on the cutting-edge technical issues driving the adhesive tape industry.

Foam Expo North America has firmly established its reputation as the world’s largest technical foam exhibition and conference.

Techtextil North America assembles all vertical aspects of the technical textile industry: from research and development through raw materials and production processes, and finally ending in conversion, further treatment, and recycling.

With a focus on the process chain of joining/bonding by means of gluing, molding, sealing, and foaming, Bondexpo offers detailed and system solutions for present and future challenges in the field of joining and bonding a broad range of materials.

With its exhibition portfolio covering the entire process chains for wet painting, powder coating, and coil coating, PaintExpo is a leading trade fair in the field of industrial coating.