Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.

Techtextil North America assembles all vertical aspects of the technical textile industry: from research and development through raw materials and production processes, and finally ending in conversion, further treatment, and recycling.

With a focus on the process chain of joining/bonding by means of gluing, molding, sealing, and foaming, Bondexpo offers detailed and system solutions for present and future challenges in the field of joining and bonding a broad range of materials.

With its exhibition portfolio covering the entire process chains for wet painting, powder coating, and coil coating, PaintExpo is a leading trade fair in the field of industrial coating.

The only knowledge-building and networking event for pressure-sensitive adhesive (PSA) tape professionals, Tape Week provides segmented, flexible learning options and extra networking time to ensure that attendees have the most valuable experience possible.