On display in booth #1946 at NACE Corrosion 2020 will be three members of the MixCoat family.
February 20, 2020
Sulzer Mixpac USA, Inc. recently announced that it will showcase its MIXPAC MixCoat cartridge-based dispensing systems at NACE Corrosion 2020, which will be held March 15-19 at the George R. Brown Convention Center in Houston, Texas.
The ceramic rotor is reportedly compatible with the dispensing and mixing systems of the ViscoTec RD dispenser series (both one- and two-component systems).
February 18, 2020
ViscoTec recently announced that it has developed a ceramic dispenser rotor for the reliable dosing of abrasive fluids such as thermally conductive one- and two-component gap fillers, one-component heat-conducting pastes, or highly filled two-component adhesives.
With their consistent mix quality, the systems reportedly reduce labor time and increase efficiency by decreasing the need for hand coating.
January 16, 2020
Sulzer Mixpac USA Inc. recently announced that its MIXPAC MixCoat Flex and MixCoat Spray cartridge-based two-component dispensing systems are ideal for touch-up and repair work of weld seams and difficult-to-reach areas on Navy ships.
With the expanded demonstration center and office space, the company has consolidated its fluid dispensing and conformal coating, test and inspection, and plasma treatment equipment into one location.
December 5, 2019
Nordson Corp. recently announced that Nordson Advanced Technology K.K. Japan has relocated to new larger office and demonstration facilities in central Tokyo to deliver sales, service, technical training, and support to its customers and sales network in Japan.
From details regarding the world’s leading adhesives and sealants manufacturers to structural adhesives and raw materials information, readers found a plethora of high-quality content to help them succeed in their businesses.
December 1, 2019
Here we list the past year’s 25 most-viewed features/case study articles on the Adhesives & Sealants Industry website.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
The FEICA Conference & Expo is a premier event for the European adhesive and sealant industry, providing essential insights into the key issues affecting the industry and great networking opportunities for formulators, customers, and suppliers.