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According to Toyochem, TSS510-HF addresses the needs of today’s electronics designers for improved shielding performance for the transmission of high-frequency signals and for high flexibility so circuits do not break when bent.
Toyochem Co., Ltd., a member of the Toyo Ink Group, has launched a flexible electromagnetic interference (EMI) shielding film, LIOELM TSS510-HF, designed to meet the performance requirements of 5G flexible printed circuits (FPCs).
Master Bond EP21TPHT is a new two-component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds that are resistant to chemicals.
Due to its high viscosity, Vitralit UC 1536 is particularly suitable for applications that require dimensional stability within the production process.
EpoxySet recently announced that it supplies EC-1012M/EH-20 flame-resistant potting compound for protecting power supplies, high-voltage batteries, coil windings, transformers, PC boards, and other electronic devices.
Formula-8 is reportedly a shear-sensitive paste that sheets out into polytetrafluoroethylene (PTFE) strings when torqued and delivers high sealing performance on all sizes of threads.
Recommended applications for SikaLastomer-714 include the sealing of bolt-in parts to vehicle flanges (i.e., truck sliders), as well as the sealing of gaskets to various substrate materials.
Dispense Works Inc. recently announced that its RP series robotic dispensing system with an optional vision-guided component performs pattern recognition and edge/hole detection for simpler setup and fixturing while assuring repeatability.
CVC Thermoset Specialties recently announced that it has developed advanced materials to help oil and gas pipeline engineers meet challenges such as corrosion, cathodic disbondment, and high-temperature resistance.
Henkel’s new Technomelt GA 3980 Ultra reportedly features excellent heat and cold resistance, improved flexibility, and high adhesive strength, even on substrates that are difficult to process.
Henkel recently announced the introduction of Technomelt GA 3980 Ultra, a hot-melt adhesive that is reportedly suitable for all melting systems and can be used for bookbinding and a variety of binding applications.
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