The U.S. Partnership for Assured Electronics was established in 2020 with a mission to ensure the U.S. government has access to resilient and trusted electronics supply chains.
March 2, 2021
The U.S. Partnership for Assured Electronics (USPAE) is inviting electronics manufacturers and related companies to participate in its programs, highlighting the opportunities to collaborate with industry peers and the U.S. government.
Henkel will leverage services from NC State’s Packaging Research in Electronic Energy Systems (PREES) lab facilities as part of the agreement.
March 2, 2021
Henkel and North Carolina State University's Future Renewable Electric Energy Delivery and Management (FREEDM) Systems Engineering Research Center recently announced a new partnership agreement designed to study the impact of materials technology on power electronics applications.
IPC APEX EXPO 2021’s virtual platform will allow attendees, exhibitors, and speakers to easily navigate more than 100 technical conference sessions, professional development courses, and product demonstrations.
March 2, 2021
IPC APEX EXPO 2021 is being held virtually on March 8-12, 2021. “Given ongoing COVID-19 health and safety concerns and continued restrictions for large gatherings and events in California, it was not feasible to safely convene the nearly 9,000 expected participants at IPC APEX EXPO 2021,” said John Mitchell, IPC president and CEO. “The event will now take place in a safe, all-virtual format.”
3M is aiming for a 50% reduction in carbon emissions by 2030, an 80% reduction by 2040, and 100% carbon neutrality in its operations by 2050.
March 1, 2021
3M recently announced it expects to invest approximately $1 billion over the next 20 years to accelerate new environmental goals: achieve carbon neutrality by 2050, reduce water use by 25% at its facilities, and return higher quality water to the environment after use in manufacturing operations.
The Adhesive and Sealant Council (ASC) announces its Training Academy schedule for 2014 which will include 14 new program titles that includes a blend of 101/201 training, business trends webinars and value-added regulatory topics. Read More
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
Techtextil North America assembles all vertical aspects of the technical textile industry: from research and development through raw materials and production processes, and finally ending in conversion, further treatment, and recycling.
With a focus on the process chain of joining/bonding by means of gluing, molding, sealing, and foaming, Bondexpo offers detailed and system solutions for present and future challenges in the field of joining and bonding a broad range of materials.