Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.

Smart materials are one of the most important researching directions in the development of high-tech new materials.

The Afera Technical Seminar brings together tape industry professionals for updates on the cutting-edge technical issues driving the adhesive tape industry.

Techtextil North America assembles all vertical aspects of the technical textile industry: from research and development through raw materials and production processes, and finally ending in conversion, further treatment, and recycling.

The European Coatings Show highlights trends and technologies in all aspects of the production of paints, coatings, sealants, construction chemicals, and adhesives.

Organizers report that Labelexpo Europe is the world’s largest event for the label and package printing industry.

Professionals from across the packaging industry attend PACK EXPO Las Vegas.

With a focus on the process chain of joining/bonding by means of gluing, molding, sealing, and foaming, Bondexpo offers detailed and system solutions for present and future challenges in the field of joining and bonding a broad range of materials.