Provided adhesives were reportedly chosen for their fast curing, high strength, and resistance to moisture, humidity, and chemicals.
December 1, 2021
Bostik recently announced that its adhesives, including solutions from the Born2Bond™ engineering adhesives range, comprise part of a repair kit that was offered by Arkema, Lalou Multi, and Bostik to all 79 teams in the Transat Jacques Vabre (TJV) multi-day yacht race.
When someone mentions medical adhesives, the first thought that often comes to mind is skin adhesion. It’s understandable, since nearly everyone has worn some type of medical adhesive product—from a simple bandage to an electrode, athletic tape, IV cover, and so on. However, an entire world of medical adhesives goes unnoticed by many: diagnostics.
From the use of renewable raw materials and sustainable production processes to the development of finished products that support environmentally friendly end uses, the adhesive and sealant industry is undertaking a broad range of activities to address sustainability.
I always love putting together our annual sustainability issue. It’s inspiring and invigorating to see the industry’s exploration of the broad scope of activities we can engage in to address sustainability. I’m reminded, though, of a restaurant with a voluminous menu. Too many options can sometimes be daunting. How can companies be sure they’re making the right choices?
The expansion is the company’s response to high demand in the region.
November 29, 2021
Sika has expanded its production capacity in the rapidly growing Chinese construction market with the opening of a new mortar production facility in Jiaxing City, in the province of Zhejiang in Eastern China.
The Adhesive and Sealant Council (ASC) announces its Training Academy schedule for 2014 which will include 14 new program titles that includes a blend of 101/201 training, business trends webinars and value-added regulatory topics. Read More
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.