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The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.
At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.
Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
The global self-adhesive labels market is projected to reach a value of $42 billion by the end of 2026, registering a CAGR of over 5.4% from 2019-2026.
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is reportedly a new single-component epoxy initially designed for glob top and chip coating applications.
These adhesives were reportedly specially formulated for applications in the electronics and consumer electronics industry, where heat-sensitive parts need to be assembled.
The global methyl methacrylate (MMA) adhesives market was valued at approximately $10.6 billion in 2018 and is projected to cross $13.5 billion by 2024.
SEMICON West will reportedly take aim at global electronics manufacturing industry disruptors with programs and pavilions focused on critical areas of industry growth.
