WEVOPUR 60210 FL T is a polyurethane system specially developed for highly complex multi-layer printed circuit boards (PCBs) used in modern battery management systems.
Pelnox, a manufacturer and supplier of epoxy, polyurethane, silicone and conductive resin products, is evaluating conductive adhesives for ground (GND) connections, EMI shield bonding and related applications inside electronic devices.
WEVOSIL 23130 offers a material solution for FIPG sealing systems that is specifically tailored to meet the requirements of the Chinese GB 38031-2025 standard.
As global data center capacity is projected to double by 2030, adhesives are playing an increasingly important role in thermal management, optical connectivity, and system reliability.