The IPC APEX EXPO 2025 is celebrating 25 years of innovation, collaboration, and community at the Anaheim Convention Center in Anaheim, California, March 18-20.
EC-1015HP epoxy potting compound from epoxySet Inc. is a heat-cure system designed for temperature cycling from -55 to 180 °C with significantly better crack resistance than traditional rigid epoxies.
A new study from Transparency Market Research predicts the global pressure sensitive adhesives (PSAs) market will experience a compound annual growth rate of 5.2% from 2022 to 2031.
From smartphones and automotive displays to wearable devices and medical equipment, businesses and consumers alike are continuing to lean into complex electronics.
To tackle the need for sustainable materials and the changing electronics industry, solventless silicone PSAs present a promising alternative to traditional solvent-based silicone PSAs.
Creative Materials Inc. has launched two new products that offer alternatives to legacy materials used in the electronics, automotive, and aerospace industries.
A new adhesive that can be used to create ultra-fine structures within seconds, DELO DUALBOND EG4797 is creating new possibilities in heterogeneous integration and optical packaging applications.