This company's electronics bonding solutions can help manufacturers achieve higher Electronic Product Environmental Assessment Tool (EPEAT) criteria ratings by earning optional points for enabling greater rework and more effective recycling.
This company’s low-pressure molding MACROMELT technology portfolio has been expanded to include a material designed specifically for high thermal stability and chemical resistance.
IPC–Association Connecting Electronics Industries® recently announced the appointment of John W. Mitchell to the position of president and CEO, effective April 23
This company recently released 125-43A/B119-44 solvent-resistant electrically conductive ink, which has been developed for touch screens and shielding applications.
Novel, all-acrylic pressure-sensitive adhesive compositions with inherently lower surface energy display significantly improved adhesion to LSE substrates such as polyethylene and polypropylene.
The prevailing trend toward the use of lighter weight and lower cost engineered plastics in automotive, construction, aerospace, electronics, and other industrial uses has created a need for pressure-sensitive materials that can bond well to these new, inherently low-surface-energy (LSE) plastics. This article discusses novel, all-acrylic compositions with inherently lower surface energy that display significantly improved adhesion to LSE substrates such as polyethylene and polypropylene.