Articles Tagged with ''adhesives in electrical/electronic''

With up to 130% elongation at break and excellent adhesion to metals and plastics, Vitralit UD 8060 F offers soft, stress-absorbing bonds for demanding applications.

Parker Chomerics THERM-A-GAP CIP 35E is a two-component dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity. 

This acrylate-based instant adhesive offers fast-curing time and high adhesive strength on metals and thermoplastics such as ABS and PVC. 

Cargill and ASU are teaming up to explore how Cargill™ Priamine™ — a biobased dimer diamine used in high-performance adhesives — can enhance the speed, efficiency, and sustainability of semiconductor technology.

Berquist Liqui Form TLF 6500 CGel-SF is an upgraded thermal curable gel designed to push the envelope of ADAS applications.

LG Chem has co-developed a high-performance silver paste with Japan’s Noritake that is designed specifically for bonding silicon carbide (SiC) chips to substrates in automotive power semiconductors. 

Meridian Adhesives Group has appointed Kevin Zhou as the new global technical director of its Electronics Division.

The IPC APEX EXPO 2026, a leading event in the electronics manufacturing industry, is now accepting abstracts for technical papers, posters, and professional development courses. 

As a technical solution provider, Bodo Möller Chemie Group supplies manufacturers throughout the entire automotive value chain with high-performance adhesives and sealants.

New adaptable adhesives, including solventless silicone PSAs, are helping manufacturers address complex stability and environmental challenges.