HOENLE ADHESIVES: Underfill for Electronics
Structalit® 8205 is dispensed on a PCB board to protect an electronic component.
Structalit® 8205 from Hoenle Adhesives is engineered to deliver exceptional mechanical stability, thermal performance, and long-term reliability in modern electronic assemblies. The board-level underfill meets demands of miniaturized and high-density electronic designs across multiple industries.
As electronic devices continue to evolve toward higher functionality, smaller form factors, and increased power density, ensuring the reliability of solder joints and sensitive components has become a critical challenge. Underfills play a key role in addressing these challenges by redistributing mechanical stress, enhancing thermal stability, and protecting assemblies from environmental influences. The underfill has been specifically developed to meet these requirements in next-generation applications such as flip chips, BGAs, and other advanced packaging technologies.
Structalit 8205 is based on a refined epoxy formulation with finely tuned filler technology. The fillers reduce the coefficient of thermal expansion (CTE), enabling better compatibility between different materials within electronic assemblies. This results in reduced stress on solder joints during temperature fluctuations, ultimately increasing product lifespan and reliability.
Additional features include a high glass transition temperature (Tg) and a balanced modulus, ensuring both rigidity and flexibility where needed; excellent capillary flow behavior, with fast and reliable flow characteristics at elevated dispensing temperatures between 80°C and 100°C, allowing it to penetrate even very narrow gaps and complex geometries; works well with all common jetting equipment with flat nozzles, performing very fast flowing at high temperatures; and rapid thermal curing, which contributes to increased throughput (UPH) and improved energy efficiency in production processes.
Once cured, the underfill provides excellent mechanical protection for solder joints, even after multiple reflow processes. The material has successfully passed 1,000 thermal cycles between -40°C and +100°C, confirming its robustness in typical operating environments.
Applications include consumer electronics, automotive electronics, industrial applications (robotics, automation systems), high-performance computing, medical devices, and aerospace and defense.
Visit Hoenle Adhesives’ website for additional information.
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