The Bergquist TGF 10000 thermal gap filler from Henkel is an advanced liquid gap filler that delivers 10 W/mK thermal conductivity. Designed for high-power applications where reliable heat dissipation is critical, Bergquist TGF 10000 reportedly sets a new benchmark for performance and versatility across sectors including automotive, telecommunications, computing, consumer electronics, and network infrastructure.

The new thermal gap filler is a pioneering product based on a silicone two-component system. As well as offering excellent thermal conductivity and consistently low thermal impedance, ensuring applicability in situations demanding high-heat-dissipation materials, it is also optimized for exceptional dispensing efficiency, with a high dispense rate and market-leading batch-to-batch flow stability. On top of performance and ease of use, Bergquist TGF 10000 also offers reliability; with raw materials selected for longevity and low volatility, it gives the user confidence in its long-term performance. It can even withstand challenging conditions, such as high humidity levels, thermal extremes (-40 °C to 150 °C), heat aging, and vibration.

“Though Bergquist TGF 10000 will be offered to a large number of industries, we see it as particularly suited to the current needs of the automotive sector,” said Michael Cai, ADAS business development manager at Henkel. “As automotive manufacturers embrace electrification and their vehicles increase in sophistication, cars will incorporate more advanced computing electronics, such as system-on-chip (SoC) modules in ADAS systems. These high-power chips handle complex tasks and will require advanced heat dissipation solutions to safeguard their performance. Bergquist TGF 10000 is built to serve a new generation of more heat-intensive automotive electronics. It offers greater thermal conductivity than ever before, without compromising its reliability, ease of use or dispensing rate.”

Learn more at henkel.com.