Two-Component Thermal Gap Filler Offers Flexibility and Precision
Image courtesy of Parker Chomerics.
Parker Chomerics THERM-A-GAP CIP 35E is a two-component dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity. CIP 35E is designed to be an alternative to hard-curing dispensable materials but also provide an improvement over standard application methods associated with thermal gap filler pads.
As a two-component dispensable material, it has an excellent flow rate and can be dispensed in high volumes or used to fill in applications that require heat transfer in challenging geometries. Once cured, CIP 35E will act as a low hardness (50 Shore 00) gap pad, able to maintain effective contact without imparting compressive forces on surrounding electronics.
With a 1:1 mix ratio and packaged in cartridges of various sizes, this material can be easily dispensed through a static mixing tip using either manual or automated dispensing equipment.
Learn more about THERM-A-GAP CIP 35E here.
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