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Items Tagged with 'sealants in electrical/electronic'
IPC recently unveiled a new Thought Leaders Program in which industry experts will assist IPC on key industry issues and offer insights to IPC members and key external stakeholders.
Apple recently announced that it will make Munich its European Silicon Design Center, adding hundreds of new employees and a new state-of-the-art facility focused on connectivity and wireless technologies.
The U.S. Partnership for Assured Electronics was established in 2020 with a mission to ensure the U.S. government has access to resilient and trusted electronics supply chains.
The U.S. Partnership for Assured Electronics (USPAE) is inviting electronics manufacturers and related companies to participate in its programs, highlighting the opportunities to collaborate with industry peers and the U.S. government.
Henkel and North Carolina State University's Future Renewable Electric Energy Delivery and Management (FREEDM) Systems Engineering Research Center recently announced a new partnership agreement designed to study the impact of materials technology on power electronics applications.
IPC APEX EXPO 2021’s virtual platform will allow attendees, exhibitors, and speakers to easily navigate more than 100 technical conference sessions, professional development courses, and product demonstrations.
IPC APEX EXPO 2021 is being held virtually on March 8-12, 2021. “Given ongoing COVID-19 health and safety concerns and continued restrictions for large gatherings and events in California, it was not feasible to safely convene the nearly 9,000 expected participants at IPC APEX EXPO 2021,” said John Mitchell, IPC president and CEO. “The event will now take place in a safe, all-virtual format.”
IPC recently announced the December 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program, reporting that orders were up by 4.5% compared to the same month last year.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
The World Adhesive and Sealant Conference & EXPO (WAC) is the most important international event for stakeholders in the adhesive and sealant industry worldwide. Read More
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