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Items Tagged with 'sealants in electrical/electronic'
According to Vertellus, its adhesives, sealants, and gels are helping a variety of device manufacturers maintain product integrity in the face of increasingly harsh environments.
According to a member survey conducted by IPC from September 25-October 2, almost 90% of U.S. electronics manufacturers are troubled by the higher tariffs imposed by the U.S. and China on each other’s imports.
Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
SEMICON West will reportedly take aim at global electronics manufacturing industry disruptors with programs and pavilions focused on critical areas of industry growth.
IPC-Association Connecting Electronics Industries® recently announced the March 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program.
Formulated to conform to highly intricate metal and plastic components, Fermapor K31 is a product line of two-component, crosslinking polyurethane formed-in-place foam sealants.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
The World Adhesive & Sealant Conference (WAC) is the most important international event for stakeholders in the Adhesive and Sealant industry worldwide. WAC takes place only once every four years alternating between the United States, Europe and Asia. Read More
