Items Tagged with 'sealants in electrical/electronic'

The IPC APEX EXPO 2026, a leading event in the electronics manufacturing industry, is now accepting abstracts for technical papers, posters, and professional development courses. 

A new thermally conductive gap filler for applications in power electronics, SEMICOSIL^® 9649 TC is a silicone product that can withstand high thermal stresses. 

The Bodo Möller Chemie Group is expanding its portfolio through a strategic partnership with Henkel Sonderhoff. 

Tapes and functional films, label materials, and RFID materials can be used in EV battery packs to mitigate thermal runaway, provide insulation, and facilitate efficient assembly.

The IPC APEX EXPO 2025 is celebrating 25 years of innovation, collaboration, and community at the Anaheim Convention Center in Anaheim, California, March 18-20. 

To tackle the need for sustainable materials and the changing electronics industry, solventless silicone PSAs present a promising alternative to traditional solvent-based silicone PSAs.

A recent collaboration between an automated dispensing systems provider and a UV/LED curing specialist created an inline, five-step process for CIPG dispensing and curing.

The engineering website has published five new selection guides with technical information about electronic component adhesives, electrically conductive adhesives, thermal adhesives, conformal coatings, and pottants and encapsulants.

Experts from the adhesive manufacturer as well as industry experts will discuss new developments in sustainable back-end packaging. 

AGC Inc. announced the opening of its AGC Chemicals Technical Center in Hsinchu, Taiwan, in October 2024.