Items Tagged with 'sealants in electrical/electronic'

How Intertronics’ polyurethane encapsulation enabled CSignum to overcome subsea structural challenges and bring its wireless EM-2 underwater communications system to market.

The Bergquist TGF 10000 thermal gap filler is Henkel’s answer to ultra-demanding electronics applications.

The silicone-based compound consists of a 2K system that cures at room temperature through an addition reaction to form an adaptable and repairable elastomer. 

The innovative silicone gel resists temperatures up to 180 °C for Generation 7 IGBT modules.

Parker Chomerics THERM-A-GAP CIP 35E is a two-component dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity. 

The IPC APEX EXPO 2026, a leading event in the electronics manufacturing industry, is now accepting abstracts for technical papers, posters, and professional development courses. 

A new thermally conductive gap filler for applications in power electronics, SEMICOSIL^® 9649 TC is a silicone product that can withstand high thermal stresses. 

The Bodo Möller Chemie Group is expanding its portfolio through a strategic partnership with Henkel Sonderhoff. 

Tapes and functional films, label materials, and RFID materials can be used in EV battery packs to mitigate thermal runaway, provide insulation, and facilitate efficient assembly.

The IPC APEX EXPO 2025 is celebrating 25 years of innovation, collaboration, and community at the Anaheim Convention Center in Anaheim, California, March 18-20.