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The electronics manufacturing industry is applauding the U.S. Senate for taking bipartisan action on legislation that will, if enacted, spur a new era of innovation, manufacturing, and investment within the electronics industry.
Contaminated printed circuit board assemblies can lead to poor performance. Oils and flux residue can prevent proper adhesion of conformal coatings, while marking inks, adhesives, and other materials can cause PCB delamination, blistering, shorting, dendrite growth, and electrochemical migration. It is therefore critical to remove all leftover manufacturing contaminants and to do it in an environmentally sustainable way.
The event featured a technical conference, professional development courses, standards development committee meetings, and a show floor that included 282 exhibitors.
February 10, 2022
Organizers of IPC APEX EXPO 2022 report that the event provided the education and networking connections that helped 3,647 visitors address today’s business challenges and prepare for their factories of the future.
We use RTV silicones in our assembly operations, and our workers keep complaining about the strong vinegar smell. Somebody told me that we might be able to get low-odor, low-volatile silicones. What issues should we be aware of?
IPC APEX EXPO returns as an in-person event January 22-27 in San Diego, Calif.
January 12, 2022
IPC APEX EXPO 2022 will welcome the electronics manufacturing community to the San Diego Convention Center in San Diego, Calif., on January 22-27. The largest North American event for the electronics manufacturing industry is expected to draw approximately 9,000 attendees from 45 countries.
Increasing silicon production without bolstering domestic advanced packaging capabilities is likely to lengthen the semiconductor supply chain because chips will still have to be sent abroad for packaging and assembly into finished products.
December 9, 2021
A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.
The Industrial Advisory Committee will consist of expert leaders representing a range of organization sizes from industry, federal laboratories, and academic institutions.
December 6, 2021
The U.S. Commerce Department has established a high-level committee to advise the U.S. government on matters related to microelectronics research, development, manufacturing, and policy and is now seeking to recruit top-level candidates to serve on the committee.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.