Items Tagged with 'sealants in electrical/electronic'

The silicone-based compound consists of a 2K system that cures at room temperature through an addition reaction to form an adaptable and repairable elastomer. 

The innovative silicone gel resists temperatures up to 180 °C for Generation 7 IGBT modules.

Parker Chomerics THERM-A-GAP CIP 35E is a two-component dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity. 

The IPC APEX EXPO 2026, a leading event in the electronics manufacturing industry, is now accepting abstracts for technical papers, posters, and professional development courses. 

A new thermally conductive gap filler for applications in power electronics, SEMICOSIL^® 9649 TC is a silicone product that can withstand high thermal stresses. 

The Bodo Möller Chemie Group is expanding its portfolio through a strategic partnership with Henkel Sonderhoff. 

Tapes and functional films, label materials, and RFID materials can be used in EV battery packs to mitigate thermal runaway, provide insulation, and facilitate efficient assembly.

The IPC APEX EXPO 2025 is celebrating 25 years of innovation, collaboration, and community at the Anaheim Convention Center in Anaheim, California, March 18-20. 

To tackle the need for sustainable materials and the changing electronics industry, solventless silicone PSAs present a promising alternative to traditional solvent-based silicone PSAs.

A recent collaboration between an automated dispensing systems provider and a UV/LED curing specialist created an inline, five-step process for CIPG dispensing and curing.