The IPC APEX EXPO 2026, a leading event in the electronics manufacturing industry, is now accepting abstracts for technical papers, posters, and professional development courses.
A new thermally conductive gap filler for applications in power electronics, SEMICOSIL® 9649 TC is a silicone product that can withstand high thermal stresses.
Tapes and functional films, label materials, and RFID materials can be used in EV battery packs to mitigate thermal runaway, provide insulation, and facilitate efficient assembly.
The IPC APEX EXPO 2025 is celebrating 25 years of innovation, collaboration, and community at the Anaheim Convention Center in Anaheim, California, March 18-20.
From smartphones and automotive displays to wearable devices and medical equipment, businesses and consumers alike are continuing to lean into complex electronics.
To tackle the need for sustainable materials and the changing electronics industry, solventless silicone PSAs present a promising alternative to traditional solvent-based silicone PSAs.
During the production of battery sensors, highly viscous liquid sealants are used to protect these sensitive electronic components from external influences and temperature-related stress and physical shock and vibrations.
October 15, 2024
A recent collaboration between an automated dispensing systems provider and a UV/LED curing specialist created an inline, five-step process for CIPG dispensing and curing.
The engineering website has published five new selection guides with technical information about electronic component adhesives, electrically conductive adhesives, thermal adhesives, conformal coatings, and pottants and encapsulants.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.