Articles Tagged with ''sealants in electrical/electronic''

Explore three advanced adhesive technologies for electronics applications, including a polyurethane potting compound, a fast-curing epoxy hardener, and low-temperature curing adhesives.

As global data center capacity is projected to double by 2030, adhesives are playing an increasingly important role in thermal management, optical connectivity, and system reliability.

Vitralit^® CIPG 60200 from Hoenle is a blue fluorescent polyacrylate sealing material specifically engineered for high-performance electronic housings in automotive and e-mobility applications.

Master Bond EP6STC-80 is engineered for bonding, sealing, and coating applications requiring exceptional thermal and electrical conductivity.

THERM-A-GAP GEL 120 from Parker Chomerics is a reworkable, high-performance, one-component, silicone, dispensable, thermal interface material with a typical thermal conductivity of 12.0 W/m-K.

How Intertronics’ polyurethane encapsulation enabled CSignum to overcome subsea structural challenges and bring its wireless EM-2 underwater communications system to market.

The Bergquist TGF 10000 thermal gap filler is Henkel’s answer to ultra-demanding electronics applications.

The silicone-based compound consists of a 2K system that cures at room temperature through an addition reaction to form an adaptable and repairable elastomer. 

The innovative silicone gel resists temperatures up to 180 °C for Generation 7 IGBT modules.

Parker Chomerics THERM-A-GAP CIP 35E is a two-component dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity.