Sealants in electrical/electronic - Articles - Page 6

DuPont Named Winner of GM Overdrive Award

The award was announced during a virtual ceremony on June 22.

July 5, 2021

DuPont Mobility & Materials announced that it has won the GM Overdrive Award for its BETASEAL™ 900 EI electrically isolating sealant in the Accelerate Innovation category.

U.S. Electronics Manufacturers May Exit the Defense Market Due to Costs Associated with Cybersecurity Maturity Model Certification

Over one-third (33%) of respondents to an industry survey conducted by IPC say the Cybersecurity Maturity Model Certification will weaken the U.S. defense electronics industrial base, while 18% are unsure.

June 25, 2021

In a recent IPC industry survey and report, 24% of electronic manufacturers say the costs and burdens of compliance with Cybersecurity Maturity Model Certification may force them out of the U.S. Department of Defense’s supply chain.

MASTER BOND: Low-Outgassing Epoxy

As a toughened system, this epoxy resists thermal cycling and is ideal for bonding dissimilar substrates.

June 22, 2021

Master Bond Supreme 70CN is a two-part epoxy adhesive formulated using a natural, renewable, and sustainable ingredient.

CEOs Urge Action to Improve Electronics Manufacturing Ecosystem

A letter organized by IPC members argues that despite the outsized importance of electronics in the modern economy, the U.S. has for decades failed to sufficiently value the importance of electronics manufacturing.

June 10, 2021

More than 50 CEOs recently urged Commerce Secretary Gina Raimondo to take concrete steps to address challenges confronting the entire U.S. electronics supply chain.

IPC APEX EXPO Technical Program Committee Calls for IPC APEX EXPO 2022 Participation

The technical conference will take place January 25-27, 2022.

June 9, 2021

The IPC APEX EXPO Technical Program Committee is inviting engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2022.

MASTER BOND: Fast-Curing, Silver-Filled Epoxy for Medical Device Assembly

With electrical and thermal conductivity properties, the epoxy bonds well to a variety of substrates, including metals, glass, ceramics, rubbers, and many plastics.

May 4, 2021

Master Bond EP77M-FMed is a two-part epoxy adhesive and sealant designed for use in the assembly of medical devices.

IPC Issues Call for Participation for IPC APEX EXPO 2022

Technical conference paper abstracts are due June 18, 2021, and professional development course proposals are due July 16, 2021.

April 16, 2021

IPC recently announced that it is inviting engineers, researchers, academics, technical experts, and industry leaders to submit abstracts for IPC APEX EXPO 2022.

IPC Launches Thought Leaders Program to Enhance Awareness and Insights on Electronics Industry Trends

One of the program’s first projects will be a report on the U.S. Defense Department’s Cybersecurity Maturity Model Certification.

March 30, 2021

IPC recently unveiled a new Thought Leaders Program in which industry experts will assist IPC on key industry issues and offer insights to IPC members and key external stakeholders.

MASTER BOND: Nanosilica-Filled, Electrically Insulative Epoxy

The compound bonds well to a variety of substrates including metals, composites, glass, ceramics, rubbers, and many plastics.

March 18, 2021

Master Bond EP21NS is a two-part epoxy that may be used for bonding, coating, sealing, and potting/encapsulating.

Apple to Invest in New Munich-Based European Silicon Design Center

The expansion is the latest step in Apple's effort to build a world-class team of engineers in Munich and across Germany.

March 18, 2021

Apple recently announced that it will make Munich its European Silicon Design Center, adding hundreds of new employees and a new state-of-the-art facility focused on connectivity and wireless technologies.