Articles Tagged with ''sealants in electrical/electronic''

WEVO-CHEMIE GmbH has developed specially optimized potting compounds and gap fillers which, in addition to targeted heat removal, also ensure the mechanical stability of the component concerned. 

Henkel has developed an innovative solution for silicone liquid gasketing for the next generation of automotive electronic components.

The webinar, focusing on different aspects of adhesives and sealants in the electronics sector, and the integral role they play in contributing to the circular economy, will take place November 23, 2023, from 10:30 to 11:30 (CET Brussels).

Henkel will showcase technologies and products advancing battery components during this year’s Battery Show North America, taking place September 12-14 in Novi, Michigan.

An innovative foam encapsulant is designed to protect the vehicle, the passengers, and the EV industry from the dangers of battery fires.

When considering potting of electronic assemblies and components, the design of these products has a significant impact on economical and sustainable production.

The ASC Convention and EXPO featured discussions and presentations focused on some of the most pressing concerns within the industry. 

Considering Europe’s future-focused drive towards an increasingly circular economy, FEICA actively supports efforts to improve product efficiency and circularity to help create a more sustainable society.

Bostik announced it has extended its Born2Bond™ engineering adhesive HMPUR and UV-CIPG ranges. 

From functionality to benefits to cost, many factors need to be considered when choosing the best potting compound for your specific application.