Appli-Tec’s 5340 is designed for potting and bonding applications. The two-part epoxy delivers high lap-shear strength and good thermal conductivity. The material is conveniently packaged in 1:1 dual cartridges; simply attach the mix nozzle for mixing.

5340 Epoxy offers excellent adhesion, an important consideration for potting and bonding applications where keeping out moisture — and preventing potential delamination — is critical.

The two-part epoxy is electrically isolating, features good dielectric properties, and 1.0 W/mK thermal conductivity. The material is RoHS Compliant and meets NASA’s outgas requirements for high reliability electronics and aerospace applications.

Learn more at www.appli-tec.com.