LG Chem has co-developed a high-performance silver paste with Japan’s Noritake that is designed specifically for bonding silicon carbide (SiC) chips to substrates in automotive power semiconductors.
A closer look at advanced testing methods reveals how operational performance of adhesive sealants can be better understood and improved for structural glazing applications.
The pronounced thixotropy and shear-thinning effect provided by pyrogenic fumed silica allows easy processing of adhesive components even at high silica loading levels.
The versatility of the PFAS-free primer also creates new opportunities for dissimilar material bonding and the development of fiber-reinforced polymer composites.