Loctite SI 5972FC from Henkel is a one-part RTV silicone form-in-place-gasket (FIPG) solution that accelerates the process of electronic module sealing. With adhesion to a range of metal and plastic surfaces, the highly dispensable liquid silicone material has been specifically designed to pass OEM’s leak or blow-out pressure tests immediately after assembly – minimizing the need for time- and space-intensive staging. With its tin-free catalyst system, Loctite SI 5972FC also provides a REACH-compliant solution for safer, more sustainable manufacturing.

Module sealing is an essential final stage in the assembly process. While liquid silicone gasketing solutions have proved a versatile option that can address multiple configurations without the inventory challenges and manual assembly required by traditional rubber O-rings, the room temperature vulcanization (RTV) curing process can be time consuming. To meet stringent OEM pressure testing, post assembly staging to achieve a full cure can take several days, prolonging cycle times and consuming floor space in the manufacturing environment.