Articles Tagged with ''sealants in electrical/electronic''

Master Bond EP6STC-80 is engineered for bonding, sealing, and coating applications requiring exceptional thermal and electrical conductivity.

THERM-A-GAP GEL 120 from Parker Chomerics is a reworkable, high-performance, one-component, silicone, dispensable, thermal interface material with a typical thermal conductivity of 12.0 W/m-K.

How Intertronics’ polyurethane encapsulation enabled CSignum to overcome subsea structural challenges and bring its wireless EM-2 underwater communications system to market.

The Bergquist TGF 10000 thermal gap filler is Henkel’s answer to ultra-demanding electronics applications.

The silicone-based compound consists of a 2K system that cures at room temperature through an addition reaction to form an adaptable and repairable elastomer. 

The innovative silicone gel resists temperatures up to 180 °C for Generation 7 IGBT modules.

Parker Chomerics THERM-A-GAP CIP 35E is a two-component dispensable thermal gap filler and cure-in-place material with 3.5 W/m-K thermal conductivity. 

The IPC APEX EXPO 2026, a leading event in the electronics manufacturing industry, is now accepting abstracts for technical papers, posters, and professional development courses. 

A new thermally conductive gap filler for applications in power electronics, SEMICOSIL^® 9649 TC is a silicone product that can withstand high thermal stresses. 

The Bodo Möller Chemie Group is expanding its portfolio through a strategic partnership with Henkel Sonderhoff.