THERM-A-GAP GEL 120 from Parker Chomerics is a reworkable, high-performance, one-component, silicone, dispensable, thermal interface material with a typical thermal conductivity of 12.0 W/m-K. The product was developed to reduce thermal junction temperatures and to effectively conduct heat away from heat generating electronics components. As a gap filler it can be used in gaps of various thicknesses created by assembly or manufacturing tolerances, from less than 0.020in (0.5mm) to 0.160in (4mm).  

The gap filler requires very low compressive force to conform under assembly pressure, thereby subjecting components, solder joints, and leads to minimal stresses. This material is a one-component, fully cured material, meaning that it does not require any secondary curing or additional processes to achieve the listed physical or thermal properties.

Applications include telecommunications equipment, consumer devices, mission-critical electronics, energy-storage devices, and automotive control units and sensors. 

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