A one component, non-frozen, silver filled epoxy, Master Bond EP6STC-80 is engineered for bonding, sealing, and coating applications requiring exceptional thermal and electrical conductivity. It offers an unlimited working life at room temperature. A full cure is achieved at a moderate temperature of 80 °C.

The epoxy delivers thermal conductivity of 13–14 W/(m·K) and high-level electrical conductivity, with volume resistivity measuring less than 0.001 ohm-cm. It bonds effectively to metals, ceramics, composites, and many plastics and is serviceable over a temperature range of -60 °C to 150 °C. EP6STC-80 is also compliant with NASA low outgassing requirements, making it an ideal choice for aerospace, electronic, and high-reliability applications where strict contamination control is essential.

The product exhibits a high strength profile, including a tensile modulus of 1,400,000–1,800,000 psi at 25 °C. The system contains no solvents or diluents and offers low shrinkage upon curing in 3–5 hours at 80 °C. Featuring a thixotropic paste consistency and a viscosity of 500,000–1,500,000 cps, it is suitable for dispensing manually or with automated systems. Packaging is available in 20g, 50g, and 100g syringes, and jars in sizes up to 200g, facilitating both precision assembly and larger-scale production.

Learn more at masterbond.com.