DELO is organizing a virtual conference, Semicon Meets Sustainability, that will take place on November 5, 2024 from 8:00 to 10:15 a.m. (CET) and in a condensed format from 5:00 to 6:40 p.m. (CET). Experts from the adhesive manufacturer as well as industry experts will discuss new developments in sustainable back-end packaging. In addition, smart materials and technologies for photonics integration that can help reduce energy consumption in the future when processing AI-generated data will be highlighted.  

Microchips are a key technology in our connected world. They drive the future while simultaneously increasing energy requirements. This is because not only semiconductor production, but also processing data obtained through new technologies such as AI, is energy-intensive. The Semicon Meets Sustainability virtual conference touches precisely on this topic.

The conference will focus on back-end packaging and answering the question of how both energy and resources can be saved. Industry experts will go over new developments and current smart materials and technologies that can help to reduce energy consumption in the future.

In addition to speakers from DELO, the conference will also feature presentations from well-known companies and research institutions. These include the Fraunhofer IZM—Institute for Reliability and Microintegration, EVG—a specialist in wafer processing equipment, OIP Technology—an expert in embedded chip technologies, and IDTechEX—known for market and trend analysis. Each presentation will be followed by a Q&A session.

Detailed information on the free semicon conference is available at www.delo-adhesives.com/semicon-virtual-conference.