October is shaping up to be an exciting month, with two major in-person industry events: The Adhesive and Sealant Council’s (ASC) Annual Convention & EXPO and The ASSEMBLY Show. Both events will feature various learning and technical sessions, exhibitions, and myriad networking activities to provide attendees with opportunities to expand their knowledge and interact with peers.
The week’s events will include a Waterborne Adhesives Short Course, informative technical sessions, an exhibition, the Executive Leadership Conference, and multiple networking opportunities.
September 30, 2021
The adhesive and sealant industry will come together for the first time in two years when the Adhesive and Sealant Council (ASC) holds its Convention & EXPO, scheduled for October 25-27 at the Omni Orlando Resort at ChampionsGate near Orlando, Fla.
The meeting will be held February 20-23 at the San Diego Mission Bay Hotel.
September 21, 2021
Organizers of the 2022 Adhesion Society Annual Meeting are seeking abstracts for presentations in all areas of adhesion science and technology, with emphasis on sustainability and adhesion, bio-adhesion, soft adhesives, and structural adhesives.
Suppliers’ Day provided an online platform for producers of adhesives and sealants to connect with the industry’s suppliers.
September 15, 2021
On September 8, 2021, FEICA (the Association of the European Adhesive & Sealant Industry) invited suppliers and service providers to share their knowledge and experience with an international audience of industry leaders and stakeholders at FEICA's first Suppliers' Day.
Henkel will introduce a new structural bonding method that accurately and efficiently cures adhesives in display applications.
September 15, 2021
At the Vehicle Displays & Interfaces Symposium, which will be held September 28-29 online and in Detroit, Mich., Henkel will introduce a new bonding solution that reportedly brings speed, performance, and flexibility to display manufacture.
Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.
The Global Tape Forum (GTF) is a technical conference involving five adhesive tape industry associations: Pressure Sensitive Tape Council in North America, Afera in Europe, CATIA in China, TAAT in Taiwan, and JATMA in Japan.