Additive Electronics Conference: PCB Scale to IC Scale examines the manufacturing and design processes enabling line width and space from .003 in. to 5 microns, as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter, and more powerful electronic devices.

Foam Expo North America has firmly established its reputation as the world’s largest technical foam exhibition and conference.

Techtextil North America assembles all vertical aspects of the technical textile industry: from research and development through raw materials and production processes, and finally ending in conversion, further treatment, and recycling.

Though the European Coatings Show has been cancelled for 2021, the European Coatings Conference will still take place in digital form on September 13-14, 2021.

Professionals from across the packaging industry attend PACK EXPO Las Vegas.

With a focus on the process chain of joining/bonding by means of gluing, molding, sealing, and foaming, Bondexpo offers detailed and system solutions for present and future challenges in the field of joining and bonding a broad range of materials.