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NewsAdhesives and Sealants TopicsAdhesives & Sealants HeadlinesCuring

RadTech Invites Abstracts for 2027 Conference

By Staffer ASI
speaker at an event

July 6, 2026

RadTech, the trade association for UV+EB technology, is calling for technical presentations and case studies focused on new applications, new materials, and real-world challenges solved with UV and EB technology to be presented at its 2027 conference.

The program for the 2027 RadTech UV+EB Technology Conference is being built around a central idea: bring your challenge, find your solution. The event will bring together people who formulate UV+EB materials and those who use them to solve practical problems, identify new opportunities, and advance products and processes.

The 2027 Call for Papers invites abstracts for technical presentations and case studies that connect advances in new materials, chemistries, equipment, and processes to real end-user needs. Areas of interest include industrial coatings, wood coatings and finishing, packaging, advanced manufacturing, additive manufacturing, electronics, optics, medical devices, semiconductor and AI infrastructure, and other emerging applications.

New for 2027, RadTech is specifically inviting case study presentations. These presentations should focus on real-world problems, what was tried, what worked, what did not, and what was learned. Successful outcomes and instructive failures are both welcome.

The 2027 program will also include a deliberate spotlight on photoinitiator technology and development, including next-generation, low-migration, polymeric, and regulatory-ready chemistries.

To learn more and submit an abstract, visit: radtech.org/radtech27-papers/.

KEYWORDS: call for papers events

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