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NewsAdhesives and Sealants TopicsAdhesives & Sealants HeadlinesCuring

RadTech Accepting Abstracts for 2024 UV&EB Technology Conference

Photo of a sticky note with drawing of a lightbulb
June 26, 2023

RadTech, the Association for UV+EB Technology, is accepting abstract submissions from those interested in presenting a technical conference paper at the RadTech UV&EB Technology and Conference, taking place May 20-22, 2024, at the Hyatt Regency Orlando, Florida. The conference is the world’s largest event dedicated to the educational, technical, and scientific advancement of UV+EB technologies. The conference is aimed at keeping industry professionals at the forefront of UV+EB technology and learning about the latest advancements.

Presenting a technical conference paper at the conference allows experts to share their experiences as well as be part of the vibrant discussions around cutting-edge technologies and groundbreaking ideas.

The technical conference paper should be no longer than 25 minutes in length with five minutes for questions and answers. To submit an abstract for the technical paper, fill out the online abstract submission form prior to September 29, 2023. The description should be sufficiently comprehensive to allow assessment of the scope and content of the paper by the conference committee.

To see a complete list of suggested topics and additional details, visit www.radtech.org/radtech24.    


KEYWORDS: associations electron beam (EB) curing events ultraviolet (UV) curing

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