The program for the 45^th Annual Meeting of the Adhesion Society has been released.

FEICA, the Association of the European Adhesive and Sealant Industry, recently released a market study focusing on “The European Adhesives and Sealants Market.”

The submissions deadline for the ASC 2022 Innovation Award is January 31.

FEICA, the Association of the European Adhesive & Sealant Industry, and the Hellenic Association of Chemical Industries (HACI) are collaborating to provide support for a nascent organization.

IPC APEX EXPO 2022 will welcome the electronics manufacturing community to the San Diego Convention Center in San Diego, Calif., on January 22-27. The largest North American event for the electronics manufacturing industry is expected to draw approximately 9,000 attendees from 45 countries.

The Thermoset Resin Formulators Association (TRFA) is inviting industry professionals to submit technical papers for its 2022 Annual Meeting. 

RadTech, the nonprofit for ultraviolet and electron beam technologies, recently announced the election of David Walker, president, CTO and co-founder of Azul 3D Inc., as a new RadTech board member. 

IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain.

Interested individuals are invited to register to attend the 45^th Annual Meeting of the Adhesion Society.

A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.